12105G [KYOCERA AVX]

CAPACITOR, CERAMIC, MULTILAYER, 50V, SURFACE MOUNT, 1210, CHIP;


型号：	12105G
厂家：	KYOCERA AVX
描述：	CAPACITOR, CERAMIC, MULTILAYER, 50V, SURFACE MOUNT, 1210, CHIP 电容器
文件：	总11页 (文件大小：308K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Y5V Dielectric

General Specifications

Y5V formulations are for general-purpose use in a limited

temperature range. They have a wide temperature character-

istic of +22% –82% capacitance change over the operating

temperature range of –30°C to +85°C.

Y5V’s high dielectric constant allows the manufacture of the

highest capacitance value in a given case size.

These characteristics make Y5V ideal for decoupling applica-

tions within limited temperature range.

PART NUMBER (see page 3 for complete part number explanation)

0805

104

Size

(L" x W")

Voltage

10V = Z

16V = Y

25V = 3

50V = 5

Dielectric

Y5V = G

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Solder

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code

Tolerance

Z = +80 –20%

PERFORMANCE CHARACTERISTICS

Capacitance Range

2200 pF to 22 µF

+80 –20%

Capacitance Tolerances

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

–30°C to +85°C

+22% to –82% max. within operating temperature

10, 16, 25 and 50 VDC (+85°C)

Dissipation Factor

For 50 volts: 5.0% max.

For 16 and 25 volts: 7% max.

For 10 volts: 10% max.

Insulation Resistance (+25°C, RVDC)

Dielectric Strength

Test Voltage

10,000 megohms min. or 1000 MΩ - µF min., whichever is less

250% of rated voltage for 5 seconds at 50 mamp max. current

1.0 Vrms 0.2 Vrms

1 KHz

Test Frequency

Y5V Dielectric

Typical Characteristic Curves**

0.1 ␮F - 0603

Impedance vs. Frequency

Temperature Coefficient

10,000

1,000

+20

+10

-10

100

-20

-30

-40

-50

-60

-70

-80

0.1

0.01

10,000

-55 -35

+125

100,000

10,000,000

-15 +5 +25 +45 +65 +85 +105

1,000,000

Frequency (Hz)

Temperature °C

0.22 ␮F - 0805

Impedance vs. Frequency

Capacitance Change

vs. DC Bias Voltage

1,000

100

+40

+20

-20

-40

-60

-80

-100

0.1

0.01

10,000

100,000

1,000,000

10,000,000

100

Frequency (Hz)

DC Bias Voltage

Insulation Resistance vs. Temperature

1 ␮F - 1206

Impedance vs. Frequency

10,000

1,000

100

1,000

100

0.1

0.01

10,000

+20

+30

+40 +50

+60 +70 +80 +85

100,000

1,000,000

10,000,000

Temperature °C

Frequency (Hz)

SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE

Style

0402*

0603*

0805*

1206*

1210*

1812*

1825*

2220

10V

2.2nF - 0.1µF

2.2nF - 1µF

10nF - 4.7µF

10nF - 10µF

10nF - 22µF

→

16V

2.2nF - 0.1µF

2.2nF - 0.33µF

10nF - 2.2µF

10nF - 4.7µF

0.1µF - 10µF

→

25V

2.2nF - 22nF

50V

2.2nF - 10nF

2.2nF - 56nF

10nF - 0.33µF

10nF - 1µF

2.2nF - 0.22µF

10nF - 1µF

10nF - 2.2µF

0.1µF - 4.7µF

0.15µF - 1.5µF

0.47µF - 1.5µF

—

0.1µF - 1µF

1.5nF - 1.5µF

0.47µF - 1.5µF

1µF - 1.5µF

0.68µF - 1.5µF

→

—

2225

→

0.68µF - 2.2µF

* Standard Sizes

** For additional information on performance changes with operating conditions consult AVX’s software SpiCap.

Y5V Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0402*

0603*

0805

1206

1210

1812*

1825*

2220*

2225*

Standard Reel

Packaging

All Paper

Paper/Embossed Paper/Embossed Paper/Embossed All Embossed

All Embossed

(in.)

1.00 .10

(.040 .004)

1.60 .15

(.063 .006)

2.01 .20

(.079 .008)

3.20 .20

(.126 .008)

3.20 .20

(.126 .008)

4.50 .30

(.177 .012)

4.50 .30

(.252 .016)

5.7 0.4

(.225 .016)

5.72 .25

(.225 .010)

(L) Length

(in.)

.50 .10

(.020 .004)

.81 .15

(.032 .006)

1.25 .20

(.049 .008)

1.60 .20

(.063 .008)

2.50 .20

(.098 .008)

3.20 .20

(.126 .008)

6.40 .40

(.252 .016)

5.0 0.4

(.197 .016)

6.35 .25

(.250 .010)

(W) Width

(in.)

.60

(.024)

.90

(.035)

1.30

(.051)

1.50

(.059)

1.70

(.067)

1.70

(.067)

1.70

(.067)

2.30

(.090)

1.70

(.067)

(T) Max. Thickness

(in.)

.25 .15

.35 .15

.50 .25

.61 .36

.64 .39

(t) Terminal

WVDC

(.010 .006)

(.014 .006)

(.020 .010)

(.024 .014)

(.025 .015)

16 25 50

10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10

Cap

(pF)

2200

2700

3300

᭢

3900

4700

5600

᭢

6800

8200

Cap

(µF)

.01

.012

.015

.018

.022

.027

.033

.039

.047

.056

.068

.082

.10

.12

.15

.18

.22

.27

.33

.39

.47

.56

.68

.82

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10.0

12.0

15.0

18.0

22.0

*Reflow soldering only.

= Paper Tape

= Embossed Tape

NOTES: For low profile product, see page 19.

How to Order

Part Number Explanation

EXAMPLE: 08055A101JAT2A

0805

101

Size

(L" x W")

0402

0504

0603

0805

1005

0907

1206

1210

1505

1805

1808

1812

1825

2225

3640

Dielectric

C0G (NP0) = A

X7R = C

Capacitance

Tolerance

C = .25 pFꢀ

D = .50 pFꢀ

F = 1ꢁ (≥ 25 pF)

G = 2ꢁ (≥ 13 pF)

J = 5ꢁ

K = 10ꢁ

M = 20ꢁ

Z = +80ꢁ, -20ꢁ

P = +100ꢁ, -0ꢁ

Terminations

Special**

Code

Standard:

T = Ni and Tin

Plated

A = Standard

Product

X5R = D

Z5U = E

Y5V = G

Non-Standard

P = Embossed

unmarked

M = Embossed

marked

E = Standard

packaging

Others:

7 = Plated Ni

Gold Plated

1 = Pd/Ag

marked

Low Profile

Chips Only

Max. Thickness

T = .66mm (.026")

S = .56mm (.022")

R = .46mm (.018")

Voltage

10V = Z

Capacitance

Code

Failure

Rate

A = Not

Applicable

16V = Y

(2 significant

digits + no. of

zeros)

25V = 3

50V = 5

100V = 1

200V = 2

250V = V

500V = 7

600V = C

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

5000V = K

Examples:

Packaging**

10 pF = 100

100 pF = 101

1,000 pF = 102

Recommended:

2 =7" Reel

4 =13" Reel

22,000 pF = 223

220,000 pF = 224

1 µF = 105

Others:

7 = Bulk Cassette

9 = Bulk

For values below 10 pF,

use “R” in place of

decimal point, e.g., 9.1

pfd = 9R1.

ꢀC&D tolerances for Յ10 pF values.

ꢀꢀ Standard Tape and Reel material depends upon chip size and thickness.

See individual part tables for tape material type for each capacitance value.

Note: Unmarked product is standard. Marked product is available on special request, please contact AVX.

Standard packaging is shown in the individual tables.

Non-standard packaging is available on special request, please contact AVX.

Surface Mounting Guide

MLC Chip Capacitors

Component Pad Design

Component pads should be designed to achieve good sol-

der filets and minimize component movement during reflow

soldering. Pad designs are given below for the most com-

mon sizes of multilayer ceramic capacitors for both wave

and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85% of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

REFLOW SOLDERING

Case Size

0402

1.70 (0.07)

2.30 (0.09)

3.00 (0.12)

4.00 (0.16)

5.60 (0.22)

6.60 (0.26)

0.60 (0.02)

0.80 (0.03)

1.00 (0.04)

1.00 (0.04))

1.00 (0.04)

0.50 (0.02)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

3.60 (0.14)

4.60 (0.18)

0.60 (0.02)

0.80 (0.03)

1.00 (0.04)

0.50 (0.02)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

2.50 (0.10)

2.00 (0.08)

3.00 (0.12)

6.35 (0.25)

5.00 (0.20)

6.35 (0.25)

0603

0805

1206

1210

1808

1812

1825

2220

2225

Dimensions in millimeters (inches)

Surface Mounting Guide

MLC Chip Capacitors

WAVE SOLDERING

Case Size

0603

3.10 (0.12)

4.00 (0.15)

5.00 (0.19)

1.20 (0.05)

1.50 (0.06)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

1.20 (0.05)

1.50 (0.06)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

2.50 (0.10)

0805

1206

1210

Dimensions in millimeters (inches)

Component Spacing

Preheat & Soldering

For wave soldering components, must be spaced sufficiently

far apart to avoid bridging or shadowing (inability of solder

to penetrate properly into small spaces). This is less impor-

tant for reflow soldering but sufficient space must be

allowed to enable rework should it be required.

The rate of preheat should not exceed 4°C/second to

prevent thermal shock. A better maximum figure is about

2°C/second.

For capacitors size 1206 and below, with a maximum

thickness of 1.25mm, it is generally permissible to allow a

temperature differential from preheat to soldering of 150°C.

In all other cases this differential should not exceed 100°C.

For further specific application or process advice, please

consult AVX.

≥1.5mm (0.06)

≥1mm (0.04)

Cleaning

Care should be taken to ensure that the capacitors are

thoroughly cleaned of flux residues especially the space

beneath the capacitor. Such residues may otherwise

become conductive and effectively offer a low resistance

bypass to the capacitor.

≥1mm (0.04)

Ultrasonic cleaning is permissible, the recommended

conditions being 8 Watts/litre at 20-45 kHz, with a process

cycle of 2 minutes vapor rinse, 2 minutes immersion in the

ultrasonic solvent bath and finally 2 minutes vapor rinse.

Surface Mounting Guide

MLC Chip Capacitors

General

APPLICATION NOTES

Surface mounting chip multilayer ceramic capacitors

are designed for soldering to printed circuit boards or other

substrates. The construction of the components is such that

they will withstand the time/temperature profiles used in both

wave and reflow soldering methods.

Storage

Good solderability is maintained for at least twelve months,

provided the components are stored in their “as received”

packaging at less than 40°C and 70% RH.

Solderability

Handling

Terminations to be well soldered after immersion in a 60/40

tin/lead solder bath at 235 5°C for 2 1 seconds.

Chip multilayer ceramic capacitors should be handled with

care to avoid damage or contamination from perspiration

and skin oils. The use of tweezers or vacuum pick ups

is strongly recommended for individual components. Bulk

handling should ensure that abrasion and mechanical shock

are minimized. Taped and reeled components provides the

ideal medium for direct presentation to the placement

machine. Any mechanical shock should be minimized during

handling chip multilayer ceramic capacitors.

Leaching

Terminations will resist leaching for at least the immersion

times and conditions shown below.

Solder

Tin/Lead/Silver Temp. °C

60/40/0 260 5

Solder

Immersion Time

Seconds

Termination Type

Nickel Barrier

30 1

Preheat

It is important to avoid the possibility of thermal shock during

soldering and carefully controlled preheat is therefore

required. The rate of preheat should not exceed 4°C/second

and a target figure 2°C/second is recommended. Although

an 80°C to 120°C temperature differential is preferred,

recent developments allow a temperature differential

between the component surface and the soldering temper-

ature of 150°C (Maximum) for capacitors of 1210 size and

below with a maximum thickness of 1.25mm. The user is

cautioned that the risk of thermal shock increases as chip

size or temperature differential increases.

Recommended Soldering Profiles

Reflow

300

Natural

Cooling

Preheat

250

200

220°C

150

100

250°C

Soldering

Mildly activated rosin fluxes are preferred. The minimum

amount of solder to give a good joint should be used.

Excessive solder can lead to damage from the stresses

caused by the difference in coefficients of expansion

between solder, chip and substrate. AVX terminations are

suitable for all wave and reflow soldering systems. If hand

soldering cannot be avoided, the preferred technique is the

utilization of hot air soldering tools.

1min

(Minimize soldering time)

10 sec. max

1min

Wave

Cooling

Natural cooling in air is preferred, as this minimizes stresses

within the soldered joint. When forced air cooling is used,

cooling rate should not exceed 4°C/second. Quenching

is not recommended but if used, maximum temperature

differentials should be observed according to the preheat

conditions above.

300

Preheat

Natural

Cooling

250

200

150

100

230°C

Cleaning

250°C

Flux residues may be hygroscopic or acidic and must be

removed. AVX MLC capacitors are acceptable for use with

all of the solvents described in the specifications MIL-STD-

202 and EIA-RS-198. Alcohol based solvents are acceptable

and properly controlled water cleaning systems are also

acceptable. Many other solvents have been proven successful,

and most solvents that are acceptable to other components

on circuit assemblies are equally acceptable for use with

ceramic capacitors.

1 to 2 min

3 sec. max

(Preheat chips before soldering)

T/maximum 150°C

Packaging of Chip Components

Automatic Insertion Packaging

TAPE & REEL QUANTITIES

All tape and reel specifications are in compliance with RS481.

8mm

12mm

Paper or Embossed Carrier

Embossed Only

0805, 1005, 1206,

1210

0504, 0907

1505, 1805,

1808

1812, 1825

2220, 2225

Paper Only

0402, 0603

2,000 or 4,000⁽¹⁾

10,000

Qty. per Reel/7" Reel

3,000

1,000

4,000

Qty. per Reel/13" Reel

10,000

⁽¹⁾Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are

not available on 13" reels. For 3640 size chip contact factory for quantity per reel.

REEL DIMENSIONS

Tape

Max.

Min.

W₂

Max.

W₁

W₃

Size⁽¹⁾

7.9 Min.

(.311)

8.4⁺–¹0^..⁰0

14.4

8mm

+.060

(.331

)

(.567)

10.9 Max.

(.429)

–0.0

330

(12.992)

1.5

(.059)

13.0 0.20

(.512 .008)

20.2

(.795)

(1.969)

11.9 Min.

(.469)

15.4 Max.

(.607)

12.4⁺–²0^..⁰0

18.4

(.724)

12mm

+.076

(.488

)

–0.0

Metric dimensions will govern.

English measurements rounded and for reference only.

(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.

Embossed Carrier Configuration

8 & 12mm Tape Only

8 & 12mm Embossed Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D₀

P₀

P₂

T Max.

T₁

G₁

G₂

8mm

and

12mm

8.4⁺-0⁰.^.0¹⁰

1.75 0.10

4.0 0.10

2.0 0.05

0.600

(.024)

0.10

(.004)

Max.

0.75

+.004

(.059

-0.0

)

(.069 .004) (.157 .004) (.079 .002)

(.030)

Min.

See Note 3

See Note 4

VARIABLE DIMENSIONS

Tape Size

B₁

D₁

P₁

T₂

A₀B₀K₀

Max.

Min.

See Note 6 See Note 5

See Note 2

8.0⁺-0⁰.^.1³

4.55

1.0

3.5 0.05

4.0 0.10

2.5 Max

(.098)

8mm

See Note 1

(.315⁺-.^.0⁰0¹4²

)

(.179)

(.039)

(.138 .002) (.157 .004)

(.984)

8.2

(.323)

1.5

(.059)

5.5 0.05

(.217 .002) (.157 .004)

4.0 0.10

(1.181)

6.5 Max.

(.256)

12.0 .30

(.472 .012)

12mm

8.0⁺-0⁰.^.1³

8mm

1/2 Pitch

4.55

(.179)

1.0

(.039)

3.5 0.05

(.138 .002) 0.79 .004

2.0 0.10

(.984)

2.5 Max.

(.098)

(.315⁺-.^.0⁰0¹4²

)

12mm

Double

Pitch

8.2

(.323)

1.5

(.059)

5.5 0.05

(.217 .002) (.315 .004)

8.0 0.10

(1.181)

6.5 Max.

(.256)

12.0 .30

(.472 .012)

NOTES:

1. A₀, B₀, and K₀are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The

clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A₀, B₀, and K₀) must be within 0.05 mm (.002) min. and 0.50 mm

(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D).

2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm

embossed tape for reels with hub diameters approaching N min. (Table 4).

3. G₁dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the

cavity whichever is less.

4. G₂dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity

or to the edge of the cavity whichever is less.

5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.

Dimensions of embossment location and hole location shall be applied independent of each other.

6. B₁dimension is a reference dimension for tape feeder clearance only.

Paper Carrier Configuration

8 & 12mm Tape Only

8 & 12mm Paper Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D₀

P₀

P₂

T₁

G₁

G₂

R MIN.

+0.1

8mm

and

12mm

1.5 ^-0.0

1.75 0.10

4.0 0.10

2.0 0.05

0.10

(.004)

Max.

0.75

(.030)

Min.

0.75

(.030)

Min.

25 (.984)

See Note 2

+.004

-.000

(.059

)

(.069 .004) (.157 .004) (.079 .002)

VARIABLE DIMENSIONS

Tape Size

P₁

A₀B₀

See Note 1

8.0⁺-0⁰.^.1³

8mm

4.0 0.10

(.157 .004)

3.5 0.05

(.138 .002)

See Note 3

(.315⁺-.^.0⁰0¹4²

)

4.0 .010

(.157 .004)

5.5 0.05

(.217 .002)

12.0 0.3

(.472 .012)

12mm

8.0⁺-0⁰.^.1³

8mm

1/2 Pitch

2.0 0.10

(.079 .004)

3.5 0.05

(.138 .002)

(.315⁺-.^.0⁰0¹4²

)

12mm

Double

Pitch

8.0 0.10

(.315 .004)

5.5 0.05

(.217 .002)

12.0 0.3

(.472 .012)

NOTES:

1. A₀, B₀, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The

clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A₀, B₀, and T) must be within 0.05 mm (.002) min. and 0.50 mm

(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A & B).

2. Tape with components shall pass around radius “R” without damage.

3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.

Bar Code Labeling Standard

AVX bar code labeling is available and follows latest version of EIA-556-A.

Bulk Case Packaging

BENEFITS

BULK FEEDER

• Easier handling

• Smaller packaging volume

(1/20 of T/R packaging)

• Easier inventory control

• Flexibility

Case

Cassette

• Recyclable

Gate

Shooter

CASE DIMENSIONS

Shutter

Slider

12mm

36mm

Mounter

Head

Expanded Drawing

110mm

Chips

Attachment Base

CASE QUANTITIES

Part Size

0402

0603

0805

Qty.

(pcs / cassette)

10,000 (T=0.6mm)

5,000 (T¯≥0.6mm)

80,000

15,000

12105G [KYOCERA AVX]

相关型号：

12105G105ZAT2A

12105G105ZAT4A

12105G106ZAT2A

12105G106ZAT4A

12105G124ZAT2A

12105G125ZAT2A

12105G155ZAT2A

12105G155ZAT4A

12105G184ZAT2A

12105G224ZAT2A

12105G224ZAT4A

12105G274ZAT4A